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| CALIFORNIA MICRO DEVICES PACDN2404C PACDN2408C PACDN2416C ESD Protection Arrays, Chip Scale Package Features * 4, 8, or 16 transient voltage suppressors in a single package * In-system Electrostatic Discharge (ESD) protection to 18kV contact discharge per IEC 61000-4-2 international standard * Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages Applications * ESD protection of I/O port connections, such as cellular phone, PDA, internet appliance and PC ports * Protection of interface ports or IC pins which are exposed to high levels of ESD * ESD protection of analog video and audio R, L, V (right, left, video) ports Product Description The PACDN2404C, PACDN2408C and PACDN2416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD. The back-toback zener connections provide ESD protection in cases where nodes with AC signals are present. These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge). All I/Os are rated at 18kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than 30kV. The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. SCHEMATIC DIAGRAMS D1 D2 D3 D4 D5 B1 B2 B3 B1 B2 B3 B4 B5 C1 B1 A1 A2 A3 A1 A2 A3 A4 A5 C2 B2 C3 B3 C4 B4 C5 B5 PACDN2404C PACDN2408C A1 A2 A3 A4 A5 PACDN2416C S TA N D A R D PA R T O R D E R I N G I N F O R M AT I O N Package Style Chip Scale Chip Scale Chip Scale (c) 2000 California Micro Devices Corp. All rights reserved. 7/17/2000 Ordering Part Number Bumps 6 10 20 Tape & Reel PACDN2404C/R PACDN2408C/R PACDN2416C/R C1230700 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 1 CALIFORNIA MICRO DEVICES PACDN2404C PACDN2408C PACDN2416C S P E C I F I C AT I O N S (At 25C unless specified otherwise) Min Reverse Stand-off Voltage, I = 10A Signal Clamp Voltage: Positive Clamp, 10mA Negative Clamp, 10mA In-system ESD withstand voltage*: Human Body Model (MIL-STD-883D, method 3015) IEC 61000-4-2, contact discharge method Clamping voltage during ESD discharge MIL-STD-883D (Method 3015), 8kV Capacitance at 2.5V dc, 1MHz Temperature Range: Operating Storage Positive Negative 5.9 6.0 -9.2 7.6 -7.6 30 18 14 -14 39 -40 -65 85 150 9.2 -6.0 Typ Max Unit V V V kV kV V V pF C * ESD applied between channel pin and ground, one at a time. All other channels are open. This parameter is guaranteed by design and characterization P R I N T E D C I R C U I T B OA R D R E C O M M E N D AT I O N S Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening Solder Flux Ratio Solder Paste Bond Trace Finish 0.300mm Round Non Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq.) 50/50 No Clean OSP (Entek Cu Plus 106A) 250 EXH 225 200 Temperature (oC) PH Z2 Z3 Z4 Z5 RF CD EXH 175 150 125 100 75 50 25 0 48 97 145 194 Time (s) 242 290 339 387 435 Typical Solder Reflow Thermal Profile (No Clean Flux) (c)2000 California Micro Devices Corp. All rights reserved. 2 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 7/17/2000 CALIFORNIA MICRO DEVICES Package Diagrams 1.804mm 0.252 mm 0.65 mm 0.65 mm B 1.154mm A 0.35mm Dia. Bumps 1 2 3 0.252 mm 0.381mm 0.643mm PACDN2404C PACDN2408C PACDN2416C PACDN2404C 3.104mm 0.252 mm 0.65 mm 0.65 mm B 1.154mm A 0.35mm Dia. Bumps 1 2 3 4 5 0.252 mm 0.381mm 0.643mm PACDN2408C 3.104mm 0.252 mm 0.65 mm 0.65 mm B A 0.35mm Dia. Bumps 1 2 3 4 5 0.252 mm 2.454mm 0.381mm 0.643mm PACDN2416C Pin Orientation Components are symmetrical, and do not require orientation to pin-1 found in conventional semiconductors. The part may be rotated 180 without affecting operation. (c) 2000 California Micro Devices Corp. All rights reserved. 7/17/2000 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 3 |
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